- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/285 - Deposition of conductive or insulating materials for electrodes from a gas or vapour, e.g. condensation
Patent holdings for IPC class H01L 21/285
Total number of patents in this class: 4986
10-year publication summary
454
|
505
|
457
|
529
|
615
|
588
|
472
|
436
|
344
|
118
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
786 |
Applied Materials, Inc. | 16587 |
443 |
Tokyo Electron Limited | 11599 |
327 |
International Business Machines Corporation | 60644 |
189 |
Samsung Electronics Co., Ltd. | 131630 |
174 |
Lam Research Corporation | 4775 |
139 |
GLOBALFOUNDRIES U.S. Inc. | 6459 |
133 |
Intel Corporation | 45621 |
124 |
ASM IP Holding B.V. | 1715 |
114 |
Kokusai Electric Corporation | 1791 |
97 |
ULVAC, Inc. | 1448 |
96 |
United Microelectronics Corp. | 3921 |
61 |
Micron Technology, Inc. | 24960 |
57 |
Semiconductor Manufacturing International (Shanghai) Corporation | 1764 |
52 |
JX Nippon Mining & Metals Corporation | 1576 |
45 |
Texas Instruments Incorporated | 19376 |
43 |
Renesas Electronics Corporation | 6305 |
43 |
Semiconductor Manufacturing International (Beijing) Corporation | 1019 |
40 |
SK Hynix Inc. | 11030 |
37 |
Tanaka Kikinzoku Kogyo K.K. | 589 |
36 |
Other owners | 1950 |